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52주 최고가 대비 71.9% 위치
Autodesk, Inc. engages in the provision of 3D design, engineering, and entertainment technology solutions worldwide. The company offers AutoCAD Civil 3D, a surveying, design, analysis, and documentation solution; Autodesk Build, a toolset for managing, sharing, and accessing project documents for streamlined workflows between the office, trailer, and jobsite; Revit, a software built for building information modeling to help professionals design, build, and maintain energy-efficient buildings; Autodesk BIM Collaborate Pro, cloud-based design collaboration and design management software; BuildingConnected, a SaaS preconstruction solution; and Tandem, a cloud-based platform that transforms the built asset lifecycle. It also provides AutoCAD software, a customizable and extensible CAD application for professional design, drafting, detailing, and visualization; AutoCAD LT, a drafting and detailing software; Fusion, a 3D CAD, computer-aided manufacturing, and computer-aided engineering tool; Inventor, a software solution that offers a set of tools for 3D mechanical design, simulation, analysis, tooling, visualization, and documentation; product design and manufacturing collection tools; and Vault, a data management software for managing data in one central location, accelerate design processes, and streamline internal/external collaboration. The company offers Flow Production Tracking, a cloud-based production management software; Maya software that offers 3D modeling, animation, effects, rendering, and compositing solutions for film and video artists, game developers, and design visualization professionals; Media and Entertainment Collection that offers end-to-end creative tools for entertainment creation; and 3ds Max software, which provides 3D modeling, animation, and rendering solutions. It sells its products and services through a network of resellers and distributors. Autodesk, Inc. was incorporated in 1982 and is headquartered in San Francisco, California.
SEC 13F 공시 기준 · 2026-Q1
SEC 13F 공시 기준 데이터입니다. 실제 현재 보유 현황과 다를 수 있으며, 투자 자문·권유·추천이 아닙니다.
| 재무 항목 | 2023년 | 2024년 | 2025년 | 2026년 |
|---|---|---|---|---|
| 주요 재무실적 (USD) | ||||
| 매출액 | $5.00B | $5.50B | $6.13B | $7.21B |
| 영업이익 | $989.0M | $1.13B | $1.37B | $1.79B |
| 당기순이익 | $823.0M | $906.0M | $1.11B | $1.12B |
| 잉여현금흐름 (FCF) | $2.02B | $1.25B | $1.50B | $2.38B |
| 수익성 비율 | ||||
| 영업이익률 | 19.8% | 20.5% | 22.3% | 24.9% |
| 순이익률 | 16.4% | 16.5% | 18.1% | 15.6% |
| ROE (자기자본이익률) | 71.9% | 48.8% | 42.4% | 36.9% |
| ROA (자산이익률) | 8.7% | 9.1% | 10.3% | 9.0% |
| 성장성 비율 | ||||
| 매출 성장률 (YoY) | - | 9.8% | 11.5% | 17.5% |
| EPS 성장률 (YoY) | - | 10.8% | 22.2% | 2.1% |
| 투자 지표 & 가치배수 | ||||
| PER (주가수익배수) | 52.6x | 61.6x | 53.6x | 47.0x |
| PBR (주가순자산배수) | 36.6x | 29.4x | 22.1x | 17.0x |
| PSR (주가매출배수) | 8.4x | 9.9x | 9.4x | 7.2x |
| FCF Yield | 4.8% | 2.3% | 2.6% | 4.6% |
| 재무 건전성 (안정성) | ||||
| 부채비율 (D/E) | 2.33 | 1.42 | 0.98 | 0.90 |
| 유동비율 | 0.84 | 0.82 | 0.68 | 0.85 |
TAIWAN SEMICONDUCTOR-SP ADR
$446.69
$2.32T